Stock code:300301
CHANGFANG LED
Home >> Tech Procedure
ABOUT US
Production technical process
The SMD product process
Holder Dehumidification
Die Bond
Plasma Cleaning
Batch Production
Initial Workpiece
Roasting
Plasma Cleaning
Remove Holder
Bonding Wire
FEATURED PRODUCTS
  • Ceramic3535
  • SMD 5050 RGBWW
  • SMD 5050 RGBW
  • SMD 5050 RGB
  • SMD 5050 White
OK
OK
Debug The Color
Dispensing
Initial Workpiece Confirmation
Roasting
NG
OK
NG
Debugging Machine
Initial Workpiece Confirmation
light Splitting
Initial Workpiece
OK
Roasting
OK
NG
Package
Reel
Storage
Initial Workpiece
Debugging Machine
OK
OK
The advantages of SMD Technological Process
1、Die bond cleaning: decrease the thickness of the Die bond glue to reduce impedance
2、Cleaning before bonding wire: increased reliability of bonding, improve ability of resist cold punching
3、Centrifugal technology advantages: improve the lighting, improve ability of resisting sulfide and thermal conductivity and heat resistance
Plasma Cleaning
Die Bond
Roasting
Plasma Cleaning
Bonding Wire
Debug The Color
Dispensing
Roasting
light Splitting
Storage
Roasting
Package
Reel
OK